With the advent of the 5G era, the direction of system development in the electronics industry is to run faster and higher frequency. This requires that the electronic components themselves that constitute the electronic system should be able to adapt to the current high-speed and high-frequency needs of electronic circuits. At the same time, it also requires higher and higher assembly density and shorter and shorter connections.
Therefore, no matter how the future development of electronic components and electronic assembly technology, it will always be inseparable from the electronic component technology that constitutes its supporting entity. The improvement of the performance of electronic components depends not only on the improvement of the production process, but also on the development of new electronic materials with higher performance, such as higher dielectric constant and higher permeability.
Therefore, an important development direction of SMD electronic components is to improve the performance of existing materials or develop new high-performance materials.