Electronic components usually include resistors, capacitors, inductors, potentiometers, trimming resistors, trimming capacitors, various sensitive components, resonators, filters, switches, relays, connectors, transformers, micro motors, etc.; however, in most cases The so-called electronic components refer to resistors, capacitors and inductors.
Electronic devices usually include diodes, transistors, integrated circuits, crystal oscillators, etc.; in most cases, the so-called devices refer to diodes, transistors and integrated circuits.
SMD electronic components and surface assembly technology are developed simultaneously to meet the needs of electronic complete machines to reduce size, reduce weight, improve performance, increase functions, increase reliability, and reduce costs. In order to achieve the purpose of not only ensuring product quality, but also improving the assembly density of electronic components, surface assembly technology has proposed many chip-type electronic components that have not been assembled using ordinary electronic components and traditional (three-dimensional) assembly technology. The requirements encountered.
In the past, with the improvement of SMD electronic component technology, the appearance of smaller size and higher quality SMD electronic components has also promoted surface assembly technology to ensure product quality, even improve product quality, and increase product functions. Under the premise of higher density assembly.
The manufacturing method of SMD electronic components has both similarities and differences with traditional electronic components. In order to make SMD electronic components, design methods different from traditional electronic components and better performance raw materials are required, and in particular, higher precision processing and manufacturing equipment is required.