The characteristics of commonly used SMD wire wound inductors

SMD wire wound inductanceis the title of the classification of the inductor structure. There are two commonly used winding type and laminated type. The former is the product of the miniaturization of traditional winding inductors; the latter is made by multilayer printing technology and laminated production technology, which is more volume than winding chip inductors. Smaller, it is the key product developed in the field of inductance components.

Winding type: It is characterized by a wide range of inductance, high accuracy, low loss, large allowable current, strong manufacturing process inheritance, simplicity, and low cost, but its disadvantage is that it is limited in further miniaturization. Wound inductors with ceramic cores can maintain a stable inductance and a relatively low loss value at high frequencies, and thus occupy a place in the high-frequency loop.

Thin film chip type: It has the characteristics of maintaining low loss, high precision, high stability and small size in the microwave frequency band. The internal electrodes are concentrated on the same layer, and the magnetic field distribution is concentrated, which can ensure that the component parameters after mounting do not change much, and show good frequency characteristics above 100MHz.

Laminated type: It has good magnetic shielding, high sintering density and good mechanical strength. The disadvantages are low pass rate, high cost, small inductance, and large loss.

Compared with wire-wound chip inductors, it has many advantages: small size, which is conducive to miniaturization of the circuit; closed magnetic circuit, will not interfere with surrounding components, and will not be interfered by neighboring components, which is beneficial to components High-density installation of devices; integrated structure, high reliability; good heat resistance and solderability; regular shape, suitable for automated surface mounting production.

Braided type: It is characterized by larger inductance per unit volume below 1MHz than other chip inductors, small size, easy to install on the substrate, and can be used as a miniature magnetic component for power processing.

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