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Electronic components integrated to take up 10 times less space on computer chips | E&T Magazine

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Researchers have demonstrated that the individual elements that make up the filter are integrated into a single electronic component. This can greatly reduce the space occupied on the computer chip.

The device manufacturing process includes depositing metal by electron beam evaporation and photolithography to define the metal pattern and etching process. Then, the final etching step triggers the self-winding process of the stacked film.

Image source: image provided by Li Xiuling

The researchers said that the team tested the performance of the rolled parts and found that under the current design, the filter is suitable for applications in the 1-10 GHz frequency range. Although these design goals are for radio frequency communication systems, the team said that based on past research, they can also achieve other frequencies, including frequencies in the megahertz range, because of their ability to implement high-power inductors. 

An electron microscope image of a series of new chip components that integrate inductors (blue) and capacitors (yellow) needed to make electronic signal filters in phones and other wireless devices.

Image source: Li Xiuling

"We used several simple filter designs, but in theory, we can use the same processing steps to combine any filter network,"

Graduate students lead research. "We use what already exists to provide a new, easier platform, integrating these components more closely than ever before."

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